Copper foil

Parameter

Chemical composition

The main component is copper (Cu), with a purity of over 99.9%

Thickness

6 µ m~12 µ m

Width

100mm~700mm

Surface roughness (Ra)

0.3 µ m~0.6 µ m

Density

8.96 g/cm ³

Tensile strength

200 MPa~300 MPa

Elongation rate

5%~10%

Hardness

50~100 HV

Conductivity

58.5 MS/m

Electrical resistivity

0.017 µ Ω· m

Thermal conductivity

398 W/m · K

Thermal expansion coefficient

 16.5 × 10 ⁻⁶/° C“